SK Hynix and HBM4: The Next Stage of the AI Memory Race
Explore how SK Hynix (KRX: 005930) is scaling HBM4 production with a $32M Hanmi Semiconductor deal to meet NVIDIA's massive demand for AI memory chips. Background SK Hynix (KRX: 000660) has officially kicked off its next phase of growth by placing a major order for High Bandwidth Memory (HBM) equipment. The company recently signed a contract worth 44.2 billion KRW (approx. $32.4 million USD) with Hanmi Semiconductor (KRX: 042700) for specialized manufacturing tools. This equipment, known as the 'TC Bonder,' is essential for stacking memory chips vertically to create HBM4, the latest and fastest version of AI memory. This move confirms that the world's leading memory makers are shifting their focus from current models to the next generation of hardware to keep up with the artificial intelligence boom. Industry Analysis Think of HBM (High Bandwidth Memory) as a massive multi-lane superhighway for data. While standard memory is like a two-lane road, HBM allows ma...